Panasonic M6 Megtron6 14-Layer 2.406mm High Frequency RF Microwave PCB ENEPIG

1.Introduction to M6 (Megtron6) 14-Layer PCB

This 14-layer rigid PCB is constructed with Panasonic M6 (Megtron6) high-speed low loss multi-layer materials, specifically Laminate R-5775 and Prepreg R-5670. M6 is a high-speed, low loss multilayer copper clad laminate designed for high-frequency, high-speed applications with low Dk glass cloth version. The board features ENEPIG surface finish (Electroless Nickel Electroless Palladium Immersion Gold), green solder mask, white silkscreen, IPC-Class-3 quality standard, 0.2mm vias with resin plug and electrolytic plating fill, and 5 impedance control structures. The finished board thickness is 2.406mm with board dimensions of 106mm x 102mm. Inner layer finished copper weight is 0.5 oz and outer layer finished copper weight is 1 oz.

2.Key Features of M6 (Megtron6) R-5775

Glass transition temperature (Tg) by DSC: 185°C
Glass transition temperature (Tg) by DMA: 210°C
Thermal decomposition temperature (Td): 410°C (TGA method)
Time to delaminate at T288 without copper: >120 minutes
Time to delaminate at T288 with copper: >120 minutes
CTE α1 X-axis (< Tg): 14-16 ppm/°C
CTE α1 Y-axis (< Tg): 14-16 ppm/°C
CTE α1 Z-axis (< Tg): 45 ppm/°C
CTE α2 Z-axis (> Tg): 260 ppm/°C
Volume resistivity: 1 x 10⁹ MΩ·cm (C-96/35/90)
Surface resistivity: 1 x 10⁸ MΩ (C-96/35/90)
Dielectric constant (Dk) at 1 GHz: 3.40
Dielectric constant (Dk) at 13 GHz: 3.34
Dissipation factor (Df) at 1 GHz: 0.002
Dissipation factor (Df) at 13 GHz: 0.0037
Water absorption: 0.14% (D-24/23)
Peel strength (1 oz H-VLP): 0.8 kN/m
Flammability rating: UL 94 V-0

3.Benefits of This 14-Layer M6 PCB

High speed, low loss material for high-frequency applications
High Tg (185°C DSC, 210°C DMA) for excellent thermal reliability
High Td (410°C) for lead-free process compatibility
Excellent time to delaminate at T288 (>120 minutes) for thermal stability
Low CTE for dimensional stability
ENEPIG surface finish provides excellent corrosion resistance, wire bondability, and solderability
Resin plug with electrolytic plating fill for 0.2mm vias ensures flat surface and reliability
5 impedance control structures for signal integrity
IPC-Class-3 quality for high-reliability applications

4.M6 (Megtron6) 14-Layer PCB Construction Details

5.PCB Stackup (14-Layer Rigid Structure)

L1 Copper: 0.035 mm (1 OZ)
PP R-5670(G): 1080(68%) x 1, 0.0846 mm
L2 Core R5775G(HVLP): 0.5 OZ
PP R-5670(G): 0.0153 mm
L3 Core R5775G(HVLP): 0.13 mm (Exclude Copper)
PP R-5670(G): 1080(68%) x 1 + 3313(59%) x 1, 0.193 mm
L4 Core R5775G(HVLP): 0.5 OZ
PP R-5670(G): 1080(68%) x 1 + 3313(59%) x 1, 0.1919 mm
L5 Core R5775G(HVLP): 0.5 OZ
PP R-5670(G): 3313(59%) x 1 + 1080(68%) x 1, 0.1946 mm
L6 Core R5775G(HVLP): 0.5 OZ
PP R-5670(G): 3313(59%) x 1 + 1080(68%) x 1, 0.1905 mm
L7 Core R5775G(HVLP): 0.5 OZ
PP R-5670(G): 3313(59%) x 1 + 1080(68%) x 1, 0.1936 mm
L8 Core R5775G(HVLP): 0.5 OZ
PP R-5670(G): 1080(68%) x 1, 0.0846 mm
L9 Copper: 0.035 mm (1 OZ)

6.Impedance Control

7.Primary Application Areas

High-speed servers
High-performance computing (HPC)
5G communication base stations
Millimeter wave radar
Data center equipment
400G/800G optical module PCBs
Aerospace and defense systems

8.Quality Assurance

Type of artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-3
Availability: Worldwide

9.M6 (Megtron6) High-Speed Low Loss Laminate – Product Introduction

Panasonic M6 laminate is a high-speed, low loss multilayer copper clad laminate specifically designed for high-frequency, high-speed applications. The material features low Dk glass cloth version with Laminate R-5775(N) and Prepreg R-5670(N). The material exhibits high glass transition temperature (185°C by DSC, 210°C by DMA), high thermal decomposition temperature (410°C by TGA), and excellent time to delaminate at T288 (>120 minutes with or without copper). The dielectric constant is 3.40 at 1 GHz and 3.34 at 13 GHz. The dissipation factor is 0.002 at 1 GHz and 0.0037 at 13 GHz. The material meets UL 94 V-0 flammability rating.

10.Features and Benefits of M6 (Megtron6)

Benefits:
High speed, low loss for high-frequency applications
High Tg and Td for excellent thermal reliability
Excellent thermal stability at T288
Low CTE for dimensional stability
UL 94 V-0 certified for flame retardancy

11.M6 (Megtron6) Data Sheet

12.Some Typical Applications

High-speed servers
High-performance computing (HPC)
5G communication base stations
Millimeter wave radar
Data center equipment
400G/800G optical module PCBs
Aerospace and defense systems

13.What is Resin Plug with Electrolytic Plating Fill?

Resin plug is a process where vias are filled with resin to create a flat surface. Electrolytic plating fill (electroplating fill) is then applied over the resin plug to provide a conductive surface. In this product, 0.2mm vias are filled with resin and then electrolytically plated flat. This ensures a flat surface for stacking or component placement, improves reliability, prevents solder wicking, and enhances thermal and electrical performance.

14.What are the Types of Impedance?

Common impedance types include:

• Single-ended impedance (signal trace referenced to ground)
• Differential impedance (pair of traces with equal and opposite signals)
• Coplanar impedance (traces with ground on same layer)

This product features 5 differential impedance control structures.

15.Fabrication Guidelines for M6 :

Material Storage: Laminate should be stored flat in a cool dry environment. Prepreg should be stored flat in a cool dry controlled environment at 73°F (23°C) or less and 50% RH or less.

Inner Layer Bond Treatment: Black or Brown Oxide can be used. Alternative Oxide Treatment with organic coating using Peroxide/Sulfuric etch technology is preferred.

Drilling: Recommended drill parameters are provided for various diameters. For 0.20mm drill: spindle speed 160 krpm, velocity 100 m/min, infeed 1.6 m/min, chipload 10 μm/rev, bit life 700-1,000 hits.

Desmear: Permanganate desmear or plasma desmear can be used. For hybrid construction with FR-4 materials, combined desmear (plasma first, then permanganate without swelling) is recommended.

Surface Finish: Ag plating, Sn plating, Direct gold plating and OSP are good for R-5775. For ENIG, baking or long time holding at room temperature (e.g. 5 hours at 150°C, 1 week at room temperature) is needed before Ni plating.